• MBD-X11DPH-I (7 PCI-E 3.0 Slots)

MBD-X11DPH-I (7 PCI-E 3.0 Slots)

2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s,Intel® C621,Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
型號 : X11DPH-I

  1. 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
    Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
  2. Intel® C621
  3. Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
    Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
  4. 3 PCI-E 3.0 x16,
    4 PCI-E 3.0 x8
    M.2 Interface: 2 PCI-E 3.0 x4
    M.2 Form Factor: 2242/2260/2280/22110
    M.2 Key: M-Key (RAID 0,1 support)
  5. 1 VGA port
  6. Intel® C621 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  7. Dual LAN with 1GbE with Intel® X722 + Marvell 88E1512

Parts List

Parts List (Bulk Package)
Name Part Number Qty Description
Motherboard MBD-X11DPH-i 1 X11DPH-i Motherboard
I/O Shield MCP-260-00042-0N 1 STD I/O SHIELD
I/O Cables CBL-0044L 2 57.5 cm SATA FLAT S-S PBF

Optional Parts List
Name Part Number Qty Description
TPM security module (optional, not included) AOM-TPM-9670V 1 SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor
TPM security module (optional, not included) AOM-TPM-9670H 1 SPI capable TPM 2.0 with Infineon 9670 controller with horizontal form factor
TPM security module (optional, not included) AOM-TPM-9671V 1 SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor
TPM security module (optional, not included) AOM-TPM-9671H 1 SPI capable TPM 1.2 with Infineon 9670 controller with horizontal form factor


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