MBD-X11DPH-I 工業級主機板

2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s,Intel® C621,Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);

型號 : X11DPH-I

數量 :

2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
Dual Socket P (LGA 3647) supported, CPU TDP support 205W TDP, 3 UPI up to 10.4 GT/s
Intel® C621
Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;
Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);
3 PCI-E 3.0 x16,
4 PCI-E 3.0 x8
M.2 Interface: 2 PCI-E 3.0 x4
M.2 Form Factor: 2242/2260/2280/22110
M.2 Key: M-Key (RAID 0,1 support)
1 VGA port
Intel® C621 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
Dual LAN with 1GbE with Intel® X722 + Marvell 88E1512

Parts List

Parts List (Bulk Package)
Name	Part Number	Qty	Description
Motherboard	MBD-X11DPH-i	1	X11DPH-i Motherboard
I/O Shield	MCP-260-00042-0N	1	STD I/O SHIELD
I/O Cables	CBL-0044L	2	57.5 cm SATA FLAT S-S PBF

Optional Parts List
Name	Part Number	Qty	Description
TPM security module (optional, not included)	AOM-TPM-9670V	1	SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor
TPM security module (optional, not included)	AOM-TPM-9670H	1	SPI capable TPM 2.0 with Infineon 9670 controller with horizontal form factor
TPM security module (optional, not included)	AOM-TPM-9671V	1	SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor
TPM security module (optional, not included)	AOM-TPM-9671H	1	SPI capable TPM 1.2 with Infineon 9670 controller with horizontal form factor