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  • SYS-111E-WR
  • SYS-111E-WR
  • SYS-111E-WR

SYS-111E-WR

1U UP WIO with 10 hot-swap 2.5" NVMe/SAS/SATA bays and 3 PCIe 5.0 slots
型號 : SYS-111E-WR
Product SKUs
SuperServer SYS-111E-WR
Motherboard
Super X13SEW-F
Processor
CPU
Core Count
  • Up to 52C/104T; Up to 300MB Cache
Note
  • Supports up to 300W TDP CPUs (Air Cooled)
GPU
Max GPU Count
  • Up to 1 double-width or 2 single-width GPUs
Supported GPU
CPU-GPU Interconnect
  • PCIe 5.0 x16 CPU-to-GPU Interconnect
System Memory
Memory
  • Slot Count: 8 DIMM slots/8 Channels
  • Max Memory (1DPC): Up to 2TB 5600MT/s ECC DDR5 RDIMM
  • View Memory Options
Memory Voltage
  • 1.1V
On-Board Devices
SATA
  • SATA (6Gbps) ; RAID 0/1/5/10 support
NVMe
Chipset
  • Intel® C741
Network Connectivity
Input / Output
LAN
  • 2 RJ45 1 GbE LAN ports
  • 1 RJ45 1 GbE Dedicated BMC LAN port (IPMI shared on LAN port 1)
USB
  • 2 USB 3.2 Gen1 Type-A ports(rear)
  • 2 USB 2.0 Type-A ports(rear)
  • 2 USB 3.2 Gen1 Type-A ports(front)
  • 1 USB 2.0 Type-A port(Header)
Video
  • 1 VGA port
Serial
  • 1 COM port(Rear)
  • 1 COM port(Header)
TPM
  • 1 TPM header
System BIOS
BIOS Type
  • AMI 32MB SPI Flash EEPROM
Management
Software
Power configurations
  • ACPI/APM Power Management
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • Supply Chain Security: Remote Attestation
  • Runtime BMC Protections
  • System Lockdown
PC Health Monitoring
CPU
  • 8 Phase-switching voltage regulator
  • Monitors for CPU Cores, Chipset Voltages, Memory
FAN
  • Fans with tachometer monitoring
  • Pulse Width Modulated (PWM) fan connectors
  • Status monitor for speed control
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 1U
Model
Dimensions and Weight
Height
  • 1.7" (43 mm)
Width
  • 17.2" (437 mm)
Depth
  • 23.5" (597 mm)
Package
  • 7.75" (H) x 23.5" (W) x 31.5" (D)
Weight
  • Gross Weight: 33.5 lbs (15.2 kg)
  • Net Weight: 21 lbs (9.53 kg)
Available Color
  • Black
Front Panel
Buttons
  • Power On/Off button
  • Unit Identification (UID) button
LED
  • Fan Fail/System Over Heat LED
  • HDD activity LED
  • Network Activity LEDs
  • Power status LED
Expansion Slots
PCI-Express (PCIe) Configuration
  • Default
    • 2 PCIe 5.0 x16 FHFL slots
    • 1 PCIe 5.0 x8 (in x16) LP slot
  • View AOC Options
Drive Bays / Storage
Drive Bays Configuration
  • Default: Total 10 bays
    • 10 front hot-swap 2.5" NVMe*/SAS*/SATA drive bays
  • (*NVMe/SAS support may require additional storage controller and/or cables)
  • View NVMe Options
  • View Drive Options
M.2
System Cooling
Fans
  • Up to 5 middle cooling PWM 40x40x56mm Fan(s)
  • Up to 1 AOC cooling Fan(s) (optional)
Air Shroud
  • 1 Air Shroud
Power Supply
2x 860W Redundant (1 + 1) Titanium Level (96%) power supplies
Dimension (WxHxL) 54.5 x 40.25 x 322 mm
Input 800W: 100-127Vac / 50-60Hz
860W: 200-240Vac / 50-60Hz
860W: 240Vdc / 50-60Hz
+12V Max: 66.67A / Min: 0A (100Vac-127Vac)
Max: 71.67A / Min: 0A (Vdc-240Vdc)
Max: 71.67A / Min: 0A (200Vac-240Vac)
5V SB Max: 4A / Min: 0A
Output Type Backplanes (gold finger)
Operating Environment
Environmental Spec.
  • Operating Temperature: 10°C to 35°C (50°F to 95°F)
  • Non-operating Temperature: -30°C to 60°C (-22°F to 140°F)
  • Operating Relative Humidity: 8% to 80% (non-condensing)
  • Non-operating Relative Humidity: 8% to 90% (non-condensing)
  1. Single Socket E (LGA-4677) 4th/5th Gen Intel®  Xeon® Scalable processors. Up to 300W TDP
  2. Intel® C741 Chipset
  3. 8 DIMMs; Supports 3DS DDR5 RDIMM. Up to 5600 MHz
  4. Onboard 1G LAN ports (Intel® i210), 1 dedicated IPMI LAN
  5. 10x front hot-swap 2.5" SATA3 drive bays (Optional all 10 hybrid Gen5 NVMe), SAS3 with additional SAS controller card
  6. Redundant Now Titanium 860W Power Supplies

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SYS-112C-TN

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