• SYS-822GS-NB3RT
  • SYS-822GS-NB3RT
  • SYS-822GS-NB3RT
  • SYS-822GS-NB3RT
  • SYS-822GS-NB3RT

SYS-822GS-NB3RT

DP Intel 8U System with NVIDIA HGX B300 8-GPU
型號 : SYS-822GS-NB3RT

Product SKUs
SYS-822GS-NB3RT
SYS-822GS-NB3RT-01-G2 Gold Series version with pre-configured components
Motherboard
Super X14DBG-LC
Processor
CPU
  • Dual Socket E2 (LGA-4710)
  • Intel® Xeon® 6700 series processors with P-cores
Core Count
  • Up to 86C/172T; Up to 336MB Cache per CPU
Note
  • Supports up to 350W TDP CPUs (Air Cooled)
GPU
Max GPU Count
  • 8 onboard GPUs
Supported GPU
  • NVIDIA SXM: HGX B300 8-GPU (288GB)
  • View GPU Options
GPU-GPU Interconnect
  • NVIDIA® NVLink™ with NVSwitch™
System Memory
Memory
  • Slot Count: 32 DIMM slots
  • Max Memory (1DPC): Up to 4TB 6400MT/s ECC DDR5 RDIMM
  • Max Memory (2DPC): Up to 8TB 6000MT/s ECC DDR5 RDIMM
  • View Memory Options
Memory Voltage
  • 1.1V
On-Board Devices
Network Connectivity
  • View AOC Options
Input / Output
LAN
  • 8 OSFP 800 GbE LAN ports (NVIDIA ConnectX®-8 SuperNIC)
  • 2 RJ45 10 GbE LAN ports (Intel® X710)
USB
  • 1 USB 3.0 Type-A port(Front)
  • 1 USB 2.0 Type-A port(Front)
Video
  • 1 VGA port
  • 1 mini-DP port
System BIOS
BIOS Type
  • AMI 64MB UEFI
Management
Software
  • SuperCloud Composer®
  • Supermicro Server Manager (SSM)
  • Super Diagnostics Offline (SDO)
  • Supermicro Thin-Agent Service (TAS)
  • SuperServer Automation Assistant (SAA) New!
Power configurations
  • Power-on mode for AC power recovery
  • ACPI Power Management
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • Supply Chain Security: Remote Attestation
  • Runtime BMC Protections
  • System Lockdown
PC Health Monitoring
CPU
  • 8+4 Phase-switching voltage regulator
  • Monitors for CPU Cores, Chipset Voltages, Memory
FAN
  • Fans with tachometer monitoring
  • Pulse Width Modulated (PWM) fan connectors
  • Status monitor for speed control
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors

Chassis
Form Factor
  • 8U Rackmount
Model
  • CSE-GP807TS-R000NP
Dimensions and Weight
Height
  • 13.8" (356 mm)
Width
  • 17.6" (449 mm)
Depth
  • 37.4" (950 mm)
Package
  • 26.38" (H) x 28.74" (W) x 50.39" (D)
Weight
  • Gross Weight: 302 lbs (137 kg)
  • Net Weight: 263 lbs (119 kg)
Available Color
  • Silver
Front Panel
Buttons
  • Power On/Off
  • UID
LED
  • HDD activity
  • LAN1 activity
  • LAN2 activity
  • Power Fail
  • Power status
  • System information (overheat/UID)
Expansion Slots
PCI-Express (PCIe) Configuration
  • Default
    • 2 PCIe 5.0 x16 FHHL slots
  • View AOC Options
Drive Bays / Storage
Drive Bays Configuration
  • Default: Total 8 bays
    • 8 front hot-swap E1.S NVMe drive bays
  • View NVMe Options
M.2
  • 2 M.2 NVMe slots (M-key; RAID support via S3808N controller)
  • View M.2 Options
System Cooling
Fans
  • Up to 12 heavy duty fans with optimal fan speed control
Power Supply
 6x 6600W Redundant (3 + 3) Titanium Level (96%) power supplies
Dimension (WxHxL)106.5 x 82.1 x 245.3 mm
Input5900W: 200-207.9Vac / 50-60Hz
6000W: 208-219.9Vac / 50-60Hz
6300W: 220-229.9Vac / 50-60Hz
6500W: 230-238.9Vac / 50-60Hz
6600W: 239-240Vac / 50-60Hz
+12VMax: 130A / Min: 0A (200Vac-207.9Vac)
Max: 130A / Min: 0A (208Vac-219.9Vac)
Max: 130A / Min: 0A (220Vac-229.9Vac)
Max: 130A / Min: 0A (230Vac-238.9Vac)
Max: 130A / Min: 0A (239Vac-240Vac)
12V SBMax: 4A / Min: 0A
Output TypeBackplanes (gold finger)
CertificationTitanium Level

[ Test Report ]
Operating Environment
Environmental Spec.
  • Operating Temperature: 10°C to 35°C (50°F to 95°F)
  • Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)

For detailed specifications, options, and compatibility, please refer to the latest official Supermicro documentation and the actual quotes/specifications from Autech.

  1. Dual Intel® Xeon® 6700 series processors with P-cores, up to 350W TDP
  2. NVIDIA HGX B300 8-GPU with 5th Generation NVLink® 1.8TB/s, 2.3TB of HBM3e GPU memory per system
  3. 32 DIMMs with up to 8TB at 5200MT/s or up to 4TB at 6400MT/s DDR5 RDIMM
  4. 8 Hot-swap E1.S NVMe storage drive bays and 2 M.2 NVMe boot drives
  5. 8 NVIDIA ConnectX®-8 SuperNICs, up to 800Gb/s, up to two dual-port NVIDIA BlueField®-3 DPUs
  6. 6x redundant (3+3) 6.6kW Titanium level power supplies
  • Scientific Research
  • Business Intelligence & Analytics
  • Finance Services and Fraud Detection
  • Large Language Model (LLM) and Generative AI
  • Conversational AI
  • Drug Discovery
  • AI/Deep Learning Training and Inference
  • High Performance Computing (HPC)
  • Autonomous Vehicle Technologies

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