Product SKUs SYS-112C-TN Motherboard Super X14SBHM Processor CPU Single Socket E2 (LGA-4710) Intel® Xeon® 6700/6500 series processors with P-cores or 6700 series processors with E-cores Core Count P-cores: Up to 86C/172T; Up to 336MB Cache E-cores: Up to 144C/144T; Up to 108MB Cache Note Supports up to 350W TDP CPUs (Air Cooled) GPU Max GPU Count Up to 2 single-width GPUs Supported GPU NVIDIA PCIe: L4 View GPU Options CPU-GPU Interconnect PCIe 5.0 x16 CPU-to-GPU Interconnect System Memory Memory Slot Count: 16 DIMM slots/8 Channels Max Memory (1DPC): Up to 2TB 6400MT/s ECC DDR5 RDIMM Max Memory (1DPC): Up to 512GB 8000MT/s ECC DDR5 MRDIMM (P-core only) Max Memory (2DPC): Up to 4TB 5200MT/s ECC DDR5 RDIMM View Memory Options Memory Voltage 1.1V On-Board Devices NVMe NVMe; RAID 0/1/5/10 support(Intel® VROC RAID key required) View NVMe Options Network Connectivity Via AIOM View AIOM Options View AOC Options Input / Output LAN 1 RJ45 1 GbE Dedicated BMC LAN port (via DC-SCM) USB 2 USB 3.2 Gen1 Type-A ports(Rear) (via DC-SCM) Video 1 Mini-DP port(Rear) (via DC-SCM) TPM 1 TPM header System BIOS BIOS Type AMI 32MB SPI Flash EEPROM Management Software SuperCloud Composer® (SCC) Supermicro Server Manager (SSM) Super Diagnostics Offline (SDO) Supermicro Thin-Agent Service (TAS) SuperServer Automation Assistant (SAA) New! Power configurations ACPI/APM Power Management Security Hardware Trusted Platform Module (TPM) 2.0 Silicon Root of Trust (RoT) – NIST 800-193 Compliant Features Cryptographically Signed Firmware Secure Boot Secure Firmware Updates Automatic Firmware Recovery Supply Chain Security: Remote Attestation Runtime BMC Protections System Lockdown PC Health Monitoring CPU Monitors for CPU Cores, Chipset Voltages, Memory FAN Fans with tachometer monitoring Pulse Width Modulated (PWM) fan connectors Status monitor for speed control Temperature Monitoring for CPU and chassis environment Thermal Control for fan connectors Certifications Operating Systems ESXi 8.0U3, ESXi 9.0, Oracle Linux 9.4, RHEL 9.4, RHEL 10.0, Windows Server 2025 View all OS Compatibility and Certification Matrix

Chassis Form Factor 1U Rackmount Model CSE-MD101TS-R000NDP Dimensions and Weight Height 1.7" (43 mm) Width 17.2" (437 mm) Depth 29.4" (747 mm) Package 8.1" (H) x 23.8" (W) x 40.6" (D) Weight Gross Weight: 47 lbs (21.3 kg) Net Weight: 31 lbs (14.1 kg) Available Color Black Front Panel Buttons Power On/Off button UID button LED HDD activity LAN1 activity LAN2 activity Power Failed LED Power status System information Expansion Slots PCI-Express (PCIe) Configuration Default 2 PCIe 5.0 x16 FHHL slots 1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible) View AOC Options Drive Bays / Storage Drive Bays Configuration Default: Total 8 bays 8 front hot-swap 2.5" PCIe 5.0 x4 NVMe*/SAS*/SATA* drive bays Option A: Total 12 bays 8 front hot-swap 2.5" PCIe 5.0 x4 NVMe*/SAS*/SATA* drive bays 4 front hot-swap 2.5" SAS*/SATA* drive bays Option B: Total 12 bays 12 front hot-swap 2.5" PCIe 5.0 x4 NVMe*/SAS*/SATA* drive bays (*NVMe/SAS/SATA support may require additional storage controller and/or cables, please see the optional parts list for details) View NVMe Options M.2 2 M.2 PCIe 5.0 x2 NVMe slots (M-key 2280(default)/22110; optional configuration) View M.2 Options System Cooling Fans Up to 8 Counter-Rotating PWM 40x40x56mm Fan(s) Air Shroud 1 CPU Air Shroud 1 M.2 Side Air Shroud Power Supply   2x 1000W Redundant (1 + 1) Titanium Level (96%) power supplies Dimension (WxHxL) 73.5 x 40 x 185 mm Input 800W: 100-127Vac / 50-60Hz 1000W: 200-240Vac / 50-60Hz +12V Max: A (100Vdc-240Vdc) Max: 66.7A (100Vac-127Vac) Max: 83A (200Vac-240Vac) 12V SB Max: 2.1A Output Type Backplanes (gold finger) Certification Titanium Level [ Test Report ] Operating Environment Environmental Spec. Operating Temperature: 10°C to 35°C (50°F to 95°F) Non-operating Temperature: -30°C to 60°C (-22°F to 140°F) Operating Relative Humidity: 8% to 80% (non-condensing) Non-operating Relative Humidity: 8% to 90% (non-condensing)

For detailed specifications, options, and compatibility, please refer to the latest official Supermicro documentation and the actual quotes/specifications from Autech.

1. All-in-one platform for cloud data centers, based on the OCP Data Center Modular Hardware System (DC-MHS) with flexible I/O and storage configurations
   Based on Modular Scalable DeNsity Optimized HPM Form Factor (M-SDNO)
   Support DC-SCM module with OpenBMC
2. Single Intel® Xeon® 6700/6500 series processors with P-cores or 6700 series processors with E-cores
3. 16 DIMM slots supporting DDR5 RDIMM(2DPC/1DPC) or MRDIMM(1DPC)
4. Support FH DPU and single slot GPU
5. Flexible networking options with 1 AIOM networking slot (OCP NIC 3.0 compatible).
6. Breeze through high throughput workloads with PCIe 5.0 NVMe drive support
7. Trusted Platform Module (TPM) 2.0 9672 onboard

• Virtualization
• CDN, Edge Nodes
• Data Center Optimized
• HPC
• Cloud Computing
• Storage Headnode